NXP Semiconductors 935271944157 Mfr Package Description: 4.50 X 7 MM, 0.65 MM PITCH, PLASTIC, MO-225, SOT-702-1, VFBGA-56 Technology: CMOS Package Shape: RECTANGULAR Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 0.6500 mm Terminal Finish: NOT SPECIFIED Terminal Position: BOTTOM Number of Functions: 16 Number of Terminals: 56 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Output Characteristics: 3-ST Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 1.2 V Supply Voltage-Nom (Vsup): 2.7 V Logic IC Type: TRANSCEIVER Number of Bits: 1 Number of Ports: 2 Output Polarity: TRUE Propagation Delay (tpd): 5.5 ns